DDR3 REGISTERED DIMM

SPECIFICATIONS

PRODUCT TYPE

DDR3 REGISTERED DIMM

PIN OUT

240

SPEED

PC3-12800 / DDR3-1600

BIT

X 8 BIT

DRAM PACKAGE TYPE

Planar

IC COMPONENT DENSITY

By using 1Gb / 2Gb

NUMBER OF IC COMPONENTS

18

MODULE DENSITY

2GB / 4GB

RANK

2

LAYER

6

ECC

YES

PARITY

NO

STACKED

NO

FINISH PROCESS

LEAD-FREE OSP + 30U” AU FINGER W/CHAMFER

MATERIAL

HALOGEN FREE MATERIAL

BOARD SIZE

1.181” X 5.250”

PIECES / PANEL

7

PANEL SIZE

8.867” X 6.050”

STATUS

SAMPLES ARE AVAILABLE UPON REQUESTS

For any further question or inquiry, , please submit requests to

educhene@modulestech.com or syeh@modulestech.com

PRODUCTS LIST

DDR3 UNBUFFERED DIMM

D3U18A

X 8 BIT, 8 IC

D3U28B

X 8 BIT, 16 IC

D3U16C

X 16 BIT, 4 IC

D3U28E

X 8 BIT, 18 IC

+

DDR3 REGISTERED DIMM

D3R28B

X 8 BIT, 18 IC

D3R14C

X 4 BIT, 18 IC